1. Wafer back grinder machine management & improvement.
2. Support to install wafer back grinder machine and troubleshooting.
3. Co-works to improve machine utilization with manufacturing, PM (Preventive Maintenance)
4. Co-works to analyze and to improve quality issues with PE (Process Engineer), PM.
5. Communicate with machine supplier to deep dive technical support.
6. Organizational document and technical report writing.
7. Attend for PO Spec review and machine buyoff
• University.
• More than 5 years of experience as wafer back grinder field service engineer.
• Experience for semiconductor equipment company like Disco, Accretech…etc.
• Have experience with wafer back grinder undocking & docking, solving hard down troubles.
• Have experience with NPI (New Product Introduction) support (Recipe setup & Optimization)
• Understand wafer back grind & dicing preparation process.
• Work with relevant departments to resolve the issue.
• Manage all KPI (Key Performance Index) and activities and follow the orders of the part lead time.
• English communication skill mandatory, Korean preference.
• Good in MS Office (Excel, Word, and PowerPoint)
• Understanding of equipment PM, equipment mechanism.