Key Responsibilities

• New Product Introduction (NPI) of System in Package (SiP) products
• Design review for manufacturing (DFM), technical risk assessment (TRA) and assembly process flow suggestion for new products from customers
• Development of new technologies required for NPI – including process, material, system
• Trouble shooting for technical or quality problems during NPI procedure
• Direct collaborations and frequent communications with customer counterparts
• Close collaboration with factory teams for seamless transition from NPI to mass production

Required (Fresher)

• Bachelor’s or Master’s degree in material, mechanical, chemical, electrical engineering or equivalent
• Intermediate or higher level of English communication skill
• Intermediate or higher level of utilization ability for Microsoft Outlook, Excel, PowerPoint, Word
• No barrier to working abroad for a long time in South Korea or the other Amkor World Wide sites

Preferred (Experienced)

• Work experience in Semiconductor package product development with customers
• Work experience in assembly process for System in Package (SiP)
• Knowledge and skills on statistical data analysis and design of experiments (JMP)
• Intermediate or higher level of skill of development project management
• Intermediate or higher level of utilization ability for AutoCAD